Li, Z. C.Pei, Zhijian J.Fisher, Graham R.2009-11-252009-11-252006-10-01http://hdl.handle.net/2097/2194Silicon wafers are the most widely used substrates for fabricating integrated circuits (ICs). The quality of ICs depends directly on the quality of silicon wafers. A series of processes are required to manufacture high quality silicon wafers. Simultaneous double side grinding (SDSG) is one of the processes to flatten the wire-sawn wafers. This paper reviews the literature on SDSG of silicon wafers, covering the history, machine development (including machine configuration, drive and support systems, and control system), and process modeling (including grinding marks and wafer shape). It also discusses some possible topics for future research.This Item is protected by copyright and/or related rights. You are free to use this Item in any way that is permitted by the copyright and related rights legislation that applies to your use. For other uses you need to obtain permission from the rights-holder(s).GrindingMachiningModelingSemiconductor materialSilicon waferSimultaneous double side grindingText