Liu, J. H.Pei, Zhijian J.Fisher, Graham R.2009-11-252009-11-252007-03-01http://hdl.handle.net/2097/2192Silicon wafers are the most widely used substrates for fabricating integrated circuits. There have been continuous demands for higher quality silicon wafers with lower prices, and it becomes more and more difficult to meet these demands using current manufacturing processes. In recent years, research has been done on electrolytic in-process dressing (ELID) grinding of silicon wafers to explore its potential to become a viable manufacturing process. This paper reviews the literature on ELID grinding, covering its set-ups, wheel dressing mechanism, and experimental results. It also discusses the technical barriers that have to be overcome before ELID grinding can be used in manufacturing.This Item is protected by copyright and/or related rights. You are free to use this Item in any way that is permitted by the copyright and related rights legislation that applies to your use. For other uses you need to obtain permission from the rights-holder(s).Electrolytic in-process dressingGrindingMachiningSemiconductor materialSilicon waferText