Dotson, JoshuaCater, RyanBai, TianStein, TaylorSteuber, Jason2014-08-082014-08-082014-08-08http://hdl.handle.net/2097/18194Kirmser Undergraduate Research Award - Group category, honorable mentionCitation: Dotson, J. (2014) Heat sink design project. Unpublished manuscript, Kansas State University, Manhattan, KS.A single phase, microchannel heat sink and an experiment to test the heat sink is designed. The heat sink is designed to cool a 30mm x 10 mm plate that is subjected to a constant heat flux of 500 W/cm^2, a maximum surface temperature of 80 *C, and a maximum pressure drop of 300 kPa. The final design uses 47 micrometer x 292 micrometer silicone channels. Finally, the design uses water at a mass flow rate of 41.657*10^-3 kg/s and a temperature rise of 8.6*C.This Item is protected by copyright and/or related rights. You are free to use this Item in any way that is permitted by the copyright and related rights legislation that applies to your use. For other uses you need to obtain permission from the rights-holder(s).MicrochannelHeat sinkMechanical engineeringMicrofluidicsText