dc.contributor.author	Dotson, Joshua
dc.contributor.author	Cater, Ryan
dc.contributor.author	Bai, Tian
dc.contributor.author	Stein, Taylor
dc.contributor.author	Steuber, Jason
dc.date.accessioned	2014-08-08T21:02:23Z
dc.date.available	2014-08-08T21:02:23Z
dc.date.issued	2014-08-08
dc.date.published	2014	en_US
dc.description	Kirmser Undergraduate Research Award - Group category, honorable mention	en_US
dc.description	Citation: Dotson, J. (2014) Heat sink design project. Unpublished manuscript, Kansas State University, Manhattan, KS.	en_US
dc.description.abstract	A single phase, microchannel heat sink and an experiment to test the heat sink is designed. The heat sink is designed to cool a 30mm x 10 mm plate that is subjected to a constant heat flux of 500 W/cm^2, a maximum surface temperature of 80 C, and a maximum pressure drop of 300 kPa. The final design uses 47 micrometer x 292 micrometer silicone channels. Finally, the design uses water at a mass flow rate of 41.65710^-3 kg/s and a temperature rise of 8.6*C.	en_US
dc.description.advisor	Betz, Amy	en_US
dc.description.course	Mechanical Engineering 573: Heat Transfer. Spring 2014	en_US
dc.identifier.uri	http://hdl.handle.net/2097/18194
dc.publisher	Kansas State University. K-State Libraries	en_US
dc.rights	This Item is protected by copyright and/or related rights. You are free to use this Item in any way that is permitted by the copyright and related rights legislation that applies to your use. For other uses you need to obtain permission from the rights-holder(s).
dc.rights.uri	https://rightsstatements.org/vocab/InC/1.0/
dc.subject	Microchannel	en_US
dc.subject	Heat sink	en_US
dc.subject	Mechanical engineering	en_US
dc.subject	Microfluidics	en_US
dc.title	Heat sink design project	en_US
dc.type	Text	en_US

Heat sink design project

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