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Now showing items 1-6 of 6

Simultaneous double side grinding of silicon wafers: a review and analysis of experimental investigations

Qin, Na; Pei, Zhijian J.; Fisher, Graham R.; Liu, J. (2009-10-19)
Grinding wheels for manufacturing of silicon wafers: a literature review

Liu, J. H.; Pei, Zhijian J.; Fisher, Graham R. (2007-01-01)
A grinding-based manufacturing method for silicon wafers: decomposition analysis of wafer surfaces

Lu, W. K.; Pei, Zhijian J.; Fisher, Graham R. (2007-02-24)
Simultaneous double side grinding of silicon wafers: a literature review

Li, Z. C.; Pei, Zhijian J.; Fisher, Graham R. (2006-10-01)
ELID grinding of silicon wafers: a literature review

Liu, J. H.; Pei, Zhijian J.; Fisher, Graham R. (2007-03-01)
Grinding of silicon wafers: a review from historical perspectives

Pei, Zhijian J.; Fisher, Graham R.; Liu, J. (2008-10-01)

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