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Now showing items 1-9 of 9

Simultaneous double side grinding of silicon wafers: a review and analysis of experimental investigations

Qin, Na; Pei, Zhijian J.; Fisher, Graham R.; Liu, J. (2009-10-19)
Mechanical drilling processes for titanium alloys: a literature review

Zhang, Pengfei; Churi, N. J.; Pei, Zhijian J.; Treadwell, C. (2008-12-11)
Grinding wheels for manufacturing of silicon wafers: a literature review

Liu, J. H.; Pei, Zhijian J.; Fisher, Graham R. (2007-01-01)
A grinding-based manufacturing method for silicon wafers: decomposition analysis of wafer surfaces

Lu, W. K.; Pei, Zhijian J.; Fisher, Graham R. (2007-02-24)
Simultaneous double side grinding of silicon wafers: a literature review

Li, Z. C.; Pei, Zhijian J.; Fisher, Graham R. (2006-10-01)
ELID grinding of silicon wafers: a literature review

Liu, J. H.; Pei, Zhijian J.; Fisher, Graham R. (2007-03-01)
Rotary ultrasonic machining of titanium alloy: effects of machining variables

Churi, N. J.; Pei, Zhijian J.; Treadwell, C. (2007-02-07)
Grinding of silicon wafers: a review from historical perspectives

Pei, Zhijian J.; Fisher, Graham R.; Liu, J. (2008-10-01)
Edge-chipping reduction in rotary ultrasonic machining of ceramics: finite element analysis and experimental verification

Li, Z. C.; Cai, Liang-Wu; Pei, Zhijian J.; Treadwell, C. (2006-10-01)

Now showing items 1-9 of 9

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