Simultaneous double side grinding of silicon wafers: a review and analysis of experimental investigations

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dc.contributor.author Qin, Na
dc.contributor.author Pei, Zhijian J.
dc.contributor.author Fisher, Graham R.
dc.contributor.author Liu, J.
dc.date.accessioned 2009-11-25T23:03:01Z
dc.date.available 2009-11-25T23:03:01Z
dc.date.issued 2009-11-25T23:03:01Z
dc.identifier.uri http://hdl.handle.net/2097/2195
dc.description.abstract Simultaneous double side grinding (SDSG) has become an important flattening process for manufacturing of 300 mm silicon wafers. However, the literature contains only a small number of papers on SDSG. In contrast, there are a large number of patents pertinent to this process. There is no review paper summarizing all these reported experimental results. This paper reviews the literature on experimental investigations on SDSG of silicon wafers. It first describes input variables in SDSG, and then presents their effects on output variables, covering warp, flatness, surface roughness, nanotopography, wafer-thickness variation, rotational asymmetry, grinding marks, subsurface damage, wheel wear, and process cycle time. It also discusses the definition,significance, and measurement of each of these output variables. Finally, it tabulates reported experiments to show what has and has not been reported in the literature. en_US
dc.relation.uri http://www.informaworld.com/openurl?genre=article&issn=1091-0344&volume=13&issue=3&spage=285 en_US
dc.rights This is an electronic version of an article published in Qin, N., Pei, Z.J., Fisher, G.R., and Liu, J., 2009, “Simultaneous double side grinding of silicon wafers: a review and analysis of experimental investigations,” Machining Science and Technology, Vol. 13, No. 3, pp. 285-316. Machining Science and Technology is available online at: http://www.informaworld.com with the open URL of your article, which would be the following address: http://www.informaworld.com/openurl?genre=article&issn=1091-0344&volume=13&issue=3&spage=285 en_US
dc.subject Flatness en_US
dc.subject Grinding en_US
dc.subject Nanotopography en_US
dc.subject Silicon wafer en_US
dc.subject Simultaneous double side grinding en_US
dc.subject Warp en_US
dc.title Simultaneous double side grinding of silicon wafers: a review and analysis of experimental investigations en_US
dc.type Article (author version) en_US
dc.date.published 2009 en_US
dc.citation.epage 316 en_US
dc.citation.issue 3 en_US
dc.citation.jtitle Machining Science and Technology en_US
dc.citation.spage 285 en_US
dc.citation.volume 13 en_US
dc.contributor.authoreid zpei en_US


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