Modeling, analysis, and experimental investigations of grinding processes

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Show simple item record Li, Zhichao 2006-09-05T14:11:27Z 2006-09-05T14:11:27Z 2006-09-05T14:11:27Z
dc.description.abstract Grinding is one of the important operations employed in modern manufacturing industry to remove materials and achieve desired geometry and surface finish. Simultaneous double side grinding (SDSG) and ultrasonic vibration assisted grinding (UVAG) are two typical cost-effective grinding processes which are utilized to grind semiconductor materials and high performance ceramic materials, respectively. The objectives of this research are to investigate several technical issues in modern grinding processes by using theoretical, numerical, and experimental research approaches. Those technical issues are related to SDSG and UVAG, which have been chosen as two typical grinding processes for this research. This thesis reviews the literature on SDSG (covering process applications, modeling of grinding marks, and modeling of wafer shapes) and UVAG (covering process applications, edge chipping, and coolant effects, etc). The theoretical research work of this thesis is conducted by developing mathematical models for grinding marks and wafers shapes in SDSG of silicon wafers. These developed models are then used to study the effects of SDSG parameters on the curvature of the grinding marks, the distance between adjacent grinding marks, and the wafer shapes. The numerical research work of this thesis is done by conducting a three dimensional (3-D) finite element analysis (FEA) of UVAG process. A 3-D FEA model is developed to study the edge chipping commonly observed in UVAG of ceramics. Edge chippings not only compromises geometric accuracy but also possibly causes an increase in machining cost. A solution to reduce the edge chipping is proposed based upon the FEA simulations and validated by pilot experiments. Several experimental studies are conducted to provide new knowledge for the UVAG process. Firstly, a novel coolant delivery system is explored for UVAG machine system. Secondly, UVAG is introduced into machining of fiber-reinforced ceramic matrix composites (CMC). Results of a feasibility study and a designed experimental investigation show that UVAG is a promising process for CMC machining. Finally, an experimental study on cutting forces during UVAG of zirconia/alumina composites is conducted. The feasibility to machine different zirconia/alumina composites using UVAG is also investigated and discussed. The findings in this thesis will provide theoretical and practical guidance for modern grinding processes especially for SDSG and UVAG. en
dc.format.extent 2411929 bytes
dc.format.mimetype application/PDF
dc.language.iso en_US en
dc.publisher Kansas State University en
dc.subject Ceramics en
dc.subject Finite Element Analysis en
dc.subject Grinding en
dc.subject Machining en
dc.subject Semiconductor en
dc.title Modeling, analysis, and experimental investigations of grinding processes en
dc.type Dissertation en Doctor of Philosophy en
dc.description.level Doctoral en
dc.description.department Department of Industrial & Manufacturing Systems Engineering en
dc.description.advisor Zhijian Pei en
dc.subject.umi Engineering, Industrial (0546) en 2006 en August en

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