The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives ...

It is difficult for the lapping-based manufacturing method currently used to manufacture the majority of silicon wafers to meet the ever-increasing demand for flatter wafers at lower costs. A grinding-based manufacturing ...

We report on the experimental study of microstructures fabricated on the surface of fused silica by two femtosecond laser pulses, a tightly focused 266 nm beam followed by a loosely focused 800 nm beam. By setting the ...

Carbon fiber-reinforced polymer (CFRP) has been widely used in aircraft components, automotive parts, and sporting goods. Hole machining is the most frequently employed operation of secondary machining for fiber-reinforced ...

Carbon fiber reinforced plastic (CFRP) composites are in demand for a variety of applications due to their superior properties. Drilling is involved in many CFRP applications. Experiments have been successfully conducted ...

Titanium and its alloys are finding prime applications in industries due to their unique properties. However, high cost of machining is one of the limiting factors for their widespread use. Tremendous efforts are being ...

Simultaneous double side grinding (SDSG) has become an important flattening process for manufacturing of 300 mm silicon wafers. However, the literature contains only a small number of papers on SDSG. In contrast, there are ...

Laser microdrilling is a common micromachining operation in many industrial applications. This paper presents a new laser microdrilling technique in which a hollow-core fiber is employed to transmit femtosecond laser pulses ...

A marginal cumulative sum (CUSUM) glyph is proposed to visualize and decompose out-of-control signals over time. The proposed visualization tool, consisting of a two-sided CUSUM and star glyphs, is capable of indicating ...