Browsing College of Engineering by Subject "Abrasive"

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Grinding of silicon wafers: a review from historical perspectives

Pei, Zhijian J.; Fisher, Graham R.; Liu, J. (2009-11-25)

The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives ...
Grinding wheels for manufacturing of silicon wafers: a literature review

Liu, J. H.; Pei, Zhijian J.; Fisher, Graham R. (2009-11-25)

Grinding is an important process for manufacturing of silicon wafers. The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used in the silicon wafer ...