Browsing College of Engineering by Subject "Abrasive"

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Browsing College of Engineering by Subject "Abrasive"

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  • Pei, Zhijian J.; Fisher, Graham R.; Liu, J. (2009-11-25)
    The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives ...
  • Liu, J. H.; Pei, Zhijian J.; Fisher, Graham R. (2009-11-25)
    Grinding is an important process for manufacturing of silicon wafers. The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used in the silicon wafer ...

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Center for the

Advancement of Digital

Scholarship

118 Hale Library

Manhattan KS 66506


(785) 532-7444

cads@k-state.edu