Browsing Industrial and Manufacturing Systems Engineering by Subject "Semiconductor material"

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Browsing Industrial and Manufacturing Systems Engineering by Subject "Semiconductor material"

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  • Liu, J. H.; Pei, Zhijian J.; Fisher, Graham R. (2009-11-25)
    Silicon wafers are the most widely used substrates for fabricating integrated circuits. There have been continuous demands for higher quality silicon wafers with lower prices, and it becomes more and more difficult to meet ...
  • Pei, Zhijian J.; Fisher, Graham R.; Liu, J. (2009-11-25)
    The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives ...
  • Liu, J. H.; Pei, Zhijian J.; Fisher, Graham R. (2009-11-25)
    Grinding is an important process for manufacturing of silicon wafers. The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used in the silicon wafer ...
  • Lu, W. K.; Pei, Zhijian J.; Fisher, Graham R. (2009-12-01)
    It is difficult for the lapping-based manufacturing method currently used to manufacture the majority of silicon wafers to meet the ever-increasing demand for flatter wafers at lower costs. A grinding-based manufacturing ...
  • Li, Z. C.; Pei, Zhijian J.; Fisher, Graham R. (2009-11-25)
    Silicon wafers are the most widely used substrates for fabricating integrated circuits (ICs). The quality of ICs depends directly on the quality of silicon wafers. A series of processes are required to manufacture high ...

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